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The latter will assist Kaynes Semicon in semiconductor packaging – outsourced semiconductor assembly and test (OSAT) packaging – across verticals. It provides custom system-on-chip design solutions for emerging technologies to address the evolving needs of industries such as artificial intelligence (AI), telecom, automotive, computing and Internet-of-Things (IoT).
Sanjay Palsamudram, chief executive of 7Rays Semiconductors, said, “This partnership will focus on global market connections and supply chain resilience. We will concentrate on emerging sectors as well as consumer-driven sectors like cloud storage, AI, IoT, robotics and advanced mechatronics.”
The Union cabinet in September approved the fourth OSAT plant in the country, with Kaynes Semicon receiving the go-ahead for its chip assembly and packaging unit. The project involves an investment of Rs 3,307 crore in Sanand, Gujarat.
The company has acquired the land in Gujarat and has signed agreements with three overseas customers – Singapore-based LightSpeed Photonics, a company in the US and another in Taiwan. For these clients, it will handle assembly, testing and packaging in India, while they will provide it with imported wafers. Its focus areas are power electronics and industrial applications.
It also has agreements with technology providers who have committed to sourcing their chip requirements from India. These include AOI Electronics of Japan, Aptos Technology in Taiwan and Globetronics Technology of Malaysia, which will also supply the wafers.
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Kaynes Semicon has also partnered with Mitsui & Co., which will supply all raw materials and gases needed for chip-making. Initially, these will be imported, but Kaynes Semicon plans to set up local production in India.
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